- Package / Case :
- Packaging :
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10 Produto
| Imagem | Modelo | Preço | Número | Existências | Fabricante | Descrever | Package / Case | Series | Packaging | Program Memory Size | Data RAM Size | Speed | Number of I/O | Operating Temperature | Supply Voltage -max | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Ver | NXP USA Inc. | IC MCU 32BIT 4MB FLASH 516MAPBGA | 516-BGA | MAC57Dxxx | Tray | 4MB (4M x 8) | 2.3M x 8 | 80MHz, 160MHz, 320MHz | - | -40°C ~ 105°C (TA) | 3.15 V ~ 5.5 V | |||
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Ver | NXP USA Inc. | IC MCU 32BIT 4MB FLASH 208LQFP | 208-LQFP Exposed Pad | MAC57Dxxx | Tray | 4MB (4M x 8) | 2.3M x 8 | 80MHz, 160MHz, 320MHz | - | -40°C ~ 105°C (TA) | 3.15 V ~ 5.5 V | |||
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Ver | NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 4MB | 208-LQFP Exposed Pad | MAC57Dxxx | Tape & Reel (TR) | 4MB (4M x 8) | 2.3M x 8 | 80MHz, 160MHz, 320MHz | - | -40°C ~ 105°C (TA) | 3.15 V ~ 5.5 V | |||
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Ver | NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 4MB | 516-BGA | MAC57Dxxx | Tape & Reel (TR) | 4MB (4M x 8) | 2.3M x 8 | 80MHz, 160MHz, 320MHz | - | -40°C ~ 105°C (TA) | 3.15 V ~ 5.5 V | |||
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Ver | NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 3MB | 516-BGA | MAC57Dxxx | Tray | 3MB (3M x 8) | 2.3M x 8 | 80MHz, 160MHz, 320MHz | - | -40°C ~ 105°C (TA) | 3.15 V ~ 5.5 V | |||
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Ver | NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 3MB | 208-LQFP Exposed Pad | MAC57Dxxx | Tape & Reel (TR) | 3MB (3M x 8) | 2.3M x 8 | 80MHz, 160MHz, 320MHz | - | -40°C ~ 105°C (TA) | 3.15 V ~ 5.5 V | |||
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Ver | NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 3MB | 208-LQFP Exposed Pad | MAC57Dxxx | Tray | 3MB (3M x 8) | 2.3M x 8 | 80MHz, 160MHz, 320MHz | - | -40°C ~ 105°C (TA) | 3.15 V ~ 5.5 V | |||
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Ver | NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 3MB | 516-BGA | MAC57Dxxx | Tape & Reel (TR) | 3MB (3M x 8) | 2.3M x 8 | 80MHz, 160MHz, 320MHz | - | -40°C ~ 105°C (TA) | 3.15 V ~ 5.5 V | |||
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Ver | NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 2MB | 208-LQFP Exposed Pad | MAC57Dxxx | Tape & Reel (TR) | 2MB (2M x 8) | 2.3M x 8 | 80MHz, 160MHz, 320MHz | - | -40°C ~ 105°C (TA) | 3.15 V ~ 5.5 V | |||
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Ver | NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 2MB | 208-LQFP Exposed Pad | MAC57Dxxx | Tray | 2MB (2M x 8) | 2.3M x 8 | 80MHz, 160MHz, 320MHz | - | -40°C ~ 105°C (TA) | 3.15 V ~ 5.5 V |
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