- Memory Size :
- Operating Temperature :
- Part Status :
- Filtro seleccionado :
10 Produto
| Imagem | Modelo | Preço | Número | Existências | Fabricante | Descrever | Package / Case | Series | Packaging | Memory Type | Memory Size | Access Time | Mounting Type | Operating Temperature | Part Status | Memory Format | Write Cycle Time - Word, Page | Memory Interface | Voltage - Supply | Supplier Device Package | Factory Stock | Minimum Quantity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
Ver | Microchip Technology | IC EEPROM 1M PARALLEL 32FLATPCK | 32-CFlatpack | - | Tube | Non-Volatile | 1Mb (128K x 8) | 120ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-Flatpack, Ceramic Bottom-Brazed | 0 | 0 | |||
|
|
|
Ver | Microchip Technology | IC EEPROM 4M PARALLEL 32FLATPCK | 32-CFlatpack | - | Tube | Non-Volatile | 4Mb (512K x 8) | 250ns | Surface Mount | -40°C ~ 85°C (TC) | Obsolete | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
|
|
|
Ver | Microchip Technology | IC EEPROM 4M PARALLEL 32FLATPCK | 32-CFlatpack | - | Tube | Non-Volatile | 4Mb (512K x 8) | 250ns | Surface Mount | 0°C ~ 70°C (TC) | Obsolete | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
|
|
|
Ver | Microchip Technology | IC EEPROM 4M PARALLEL 32FLATPCK | 32-CFlatpack | - | Tube | Non-Volatile | 4Mb (512K x 8) | 200ns | Surface Mount | -40°C ~ 85°C (TC) | Obsolete | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
|
|
|
Ver | Microchip Technology | IC EEPROM 4M PARALLEL 32FLATPCK | 32-CFlatpack | - | Tube | Non-Volatile | 4Mb (512K x 8) | 200ns | Surface Mount | 0°C ~ 70°C (TC) | Obsolete | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
|
|
|
Ver | Microchip Technology | IC EEPROM 1M PARALLEL 32FLATPCK | 32-CFlatpack | - | Tube | Non-Volatile | 1Mb (128K x 8) | 120ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
|
|
|
Ver | Microchip Technology | IC EEPROM 1M PARALLEL 32FLATPCK | 32-CFlatpack | - | Tube | Non-Volatile | 1Mb (128K x 8) | 150ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
|
|
|
Ver | Microchip Technology | IC EEPROM 1M PARALLEL 32FLATPCK | 32-CFlatpack | - | Tube | Non-Volatile | 1Mb (128K x 8) | 250ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
|
|
|
Ver | Microchip Technology | IC EEPROM 1M PARALLEL 32FLATPCK | 32-CFlatpack | - | Tube | Non-Volatile | 1Mb (128K x 8) | 200ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-Flatpack, Ceramic Bottom-Brazed | 0 | 15 | |||
|
|
|
Obter UMA citação |
13
Disponível EM stock
|
Microchip Technology | IC EEPROM 1M PARALLEL 32FLATPCK | 32-CFlatpack | - | Tube | Non-Volatile | 1Mb (128K x 8) | 120ns | Surface Mount | -55°C ~ 125°C (TC) | Active | EEPROM | 10ms | Parallel | 4.5 V ~ 5.5 V | 32-Flatpack, Ceramic Bottom-Brazed | 0 | 1 |
1 / 1 Página
